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TrendForce reported MLC NAND spot prices have tripled since late 2025 as Samsung and Kioxia exit supply; The supply pullback has tightened availability
TrendForce reported Snapdragon 8 Elite Gen 6 Pro pricing may exceed US$300 on TSMC 2nm; The cost level could risk adoption among Qualcomm partners
Atlas PCB reported TSMC is pushing CoPoS exclusivity to lock in next-gen packaging leadership; CoWoS capacity is expected to reach 140,000 wafers per month by…
Wccftech reported Snapdragon 8 Elite Gen 6 Pro may be out of reach for many Qualcomm partners due to abnormal 2nm pricing; The report reinforces adoption risk…
SemiAnalysis published an EDA primer covering the flow from RTL to silicon; The item is educational context rather than a discrete market-moving development
TrendForce reported TI is raising select power component prices by 5-15% in July; The report links the increase to de-China supply-chain shifts and upcycle…
TrendForce reported TSMC flagged four key challenges in its Arizona buildout even as the U.S. fab is beating expectations; The challenges point to remaining…
TrendForce reported MediaTek is adopting a dual packaging strategy using Intel EMIB and TSMC CoWoS for its AI ASIC push; The approach diversifies packaging…
Wccftech reported BofA estimates an Apple-Intel chip deal could trigger a €4.6B equipment cycle, with ASML positioned to benefit; The estimate ties customer…
Tom's Hardware reported AMD is developing a rumored entry-level RDNA 4 GPU with 8GB of VRAM; The RX 9050 is described as a lower-tier product with 2048 cores
Wccftech reported Tesla may move AI6.5 chip production from TSMC to Intel under pressure from the Trump administration; The report links sourcing changes to…
Wccftech reported Nvidia's Vera CPU has early buyers including CoreWeave, Meta, Oracle, and Alibaba; The report frames Vera as opening a multi-billion-dollar…
Wccftech reported Qualcomm and MediaTek are pushing 2nm SoCs to close the performance gap with Apple, with possible mass-adoption risk; The report frames 2nm…
Wccftech reported Nvidia said first Vera Rubin shipments are rolling out in July to major AI customers, with mass production expected in 2H26; The report…
TrendForce reported SK hynix is testing Intel EMIB 2.5D packaging with HBM amid TSMC CoWoS tightness; The testing reflects active qualification of non-CoWoS…
Wccftech reported Apple tapped Intel to make next-generation MacBook Neo A21 chips; The reported Apple-Intel cooperation would apply to chips competing with…
Wccftech reported Samsung Foundry won a 2nm CPU order from a North American fabless customer identified as AMD; The report indicates a major advanced-node win…
TrendForce reported Arm's CEO said agentic AI could drive CPU core counts to 512 as GPU-to-CPU ratios become less relevant; The comment reframes CPU scaling…
TrendForce reported NXP and TI are preparing their second chip price increases this year for June and July; The move extends the analog and embedded chip…
TrendForce reported Apple is keeping 2nm 5G modem orders with TSMC despite cooperation signals with Intel; Apple's advanced modem sourcing remains anchored to…
TechCrunch reported Nvidia has committed US$40B to equity AI deals this year; The investments extend Nvidia's influence across the AI ecosystem
DIGITIMES reported Coherent's order backlog extends to 2030 as 1.6T optics and 6-inch InP capacity accelerate; Demand visibility spans multiple years
TSMC announced a preliminary agreement with Sony Semiconductor Solutions for a next-generation image sensor strategic partnership; The agreement targets future…
Semiconductor Engineering reported 3D-ICs require a new approach to power integrity for AI-scale systems; The analysis highlights power delivery as a design…
Yahoo Finance reported the Apple-Intel chip deal is reshaping supply-chain and valuation debate; Coverage reinforces the strategic importance of Intel…
TechCrunch published analysis framing Intel's comeback story as stronger than headline perception; The piece aggregates recent recovery signals around…
Tom's Hardware reported SK hynix customers are offering to buy EUV tools and fund new fab lines as memory capacity hits zero; Offers reportedly reach hundreds…
Tom's Hardware reported Apple and Intel reached a preliminary agreement for Intel to manufacture some Apple processors; The report marks a potential foundry…
DIGITIMES analysis reported AMD overtook Intel in data center revenue as agentic AI revived x86 CPU demand; The analysis links CPU demand to agentic AI…
DIGITIMES reported Intel is shifting data center chip packaging to Vietnam and expanding EMIB advanced packaging integration; The move adds packaging capacity…
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